Method for manufacturing low-profile highly-packed semiconductor devices

【Patent Name】 Method for manufacturing a semiconductor device with a low profile height package 【Applicant】 Semiconductor Component Industry Co., Ltd. [Inventor] J.H.Nappe; J.A.Yorde; H.G.Anderson[Master Applicant address] Arizona, United States [application number] 03826365.3
【 Application Date 】 2003.04.29
【Approval Announcement No.】 1771591
【 Validation announcement date 】 2006.05.10
【 Main classification number】 H01L21/68(2006.01)I
[Classification] H01L21/68(2006.01)I H01L21/56(2006.01)I H01L21/607(2006.01)I
[Sovereign Items] 1. A method of manufacturing a semiconductor device, comprising: mounting a semiconductor chip on a mounting tape and over a hole in the mounting tape; vacuuming through the hole to fix the semiconductor chip; and A wire bond is attached to the first surface of the semiconductor chip while evacuating.
[Instructions CD-ROM] D0619-1
【International Application】 2003-04-29 PCT/US2003/013027
【International Publication】 2004-11-18 WO2004/100255 Ying [Abstract] A semiconductor device (10) is mounted on a mounting tape (12) by mounting the bottom surfaces of a semiconductor chip (14) and leads (15,17) and Install the bag above the hole (19). When the top surface (43) of the lead wire is wire bonded to the top surface (32) of the semiconductor chip, vacuum is drawn through the hole to hold the semiconductor die in place. A molding material is formed so as to encapsulate the top surface of the semiconductor chip and expose its bottom surface.
【 Agency 】 China Council for the Promotion of International Trade Patent and Trademark Office 【Author】 Wang Yanbin