Model NO.: SZ-MB002
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
Function: Anti Static, Moisture Barrier, Light Isolation
Industrial Use: Electronic Components, Semiconductive Industry
Color: Silver
Surface Handling: Gravure Printing
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
Trademark: DIASAP
Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
Specification: SGS ROHS report
Origin: China Suzhou
HS Code: 3923210000
ESD Moisture Barrier Bag for Integrated Chip Packaging
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This aluminum foil bag is usually composed of four layers, and can protect inside products frostatic, electromagnetic interference, and moisture.
This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.
This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.
This laminated bag can print all symbols and can be customized according to customers' request.
This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.
This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.
This laminated bag can print all symbols and can be customized according to customers' request.
This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
Product Description | |
Product Name | ESD Moisture Barrier Bag for Integrated Chip Packaging |
 Material Structure |
Layers Laminated Material: Â PET/AL/NY/PEÂ Â BOPP/AL/PE |
 Feature | Anti-static, moisture barrier,light isolation |
Printing | Customized |
Surface Resistance | 10^6~10^11 Ohm |
Thickness | Customized(0.06--0.2mm available) |
  Bag Style | Open top/ zip lock/ envelope/ gusset/ three dimensional |
Package | 50~100pcs per bag and then in cartons or as per customer's request |
Usage | Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
Technical Parameters:
NO. | Item | Standard | Result |
1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
3 | Decay time | Â IEC61340-5-1 | <0.3s |
4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
6 | Heat-Seal Temperature |  | 160%±10% |
7 | Heat-Seal Pressure | Â | 70Pa |
8 | Heat-Seal Time |  | ≤1.5S |
Product Pictures:Â
Factory show:
 Factory show:
Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab SeriesÂ
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
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Contact us:
AbbyÂ
Suzhou SKY Industrial Co., Ltd.
Add.: 36# Zhong'An Road, Puzhuang, Suzhou, Jiangsu, China
Zip code: 215105
Tel: +8613270975606
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Free samples will be sent for your evaluation!  Â
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